Technical damage provides valuable information – if it is systematically investigated. This is precisely where the five-day advanced training course “Systematic Assessment of Technical Damage Cases” comes in, which will take place from 9 – 13 March 2026. It is aimed at engineers, technicians, and scientists with a basic technical understanding who would like to deepen their knowledge of damage analysis in a targeted manner.

The focus is on the question: What clues do defective components provide about stress, material selection, and manufacturing quality? Participants learn to recognize and evaluate typical damage mechanisms such as violent fracture, fatigue fracture, corrosion, or hydrogen-induced cracks. In addition to theoretical basics, the focus is primarily on case studies and practical analyses.

Special attention is paid to the macroscopic and microscopic characteristics of metallic materials in the event of failure. The training course offers, among other things, introductions to electron microscopy, insights into special fracture phenomena, and modern non-destructive testing methods. The program is supplemented by group work, discussions, and the opportunity to bring your own damage cases and discuss them with experts.

The structured daily agenda—from Monday to Friday—enables concentrated learning without distractions. Theory and practice alternate, and there is plenty of opportunity for mutual exchange.

Why Participate?
A better understanding of material failure enables targeted damage prevention, thereby increasing quality, safety, and reliability in product development and manufacturing.

The training course is particularly suitable for specialists from research, development, quality assurance, and manufacturing who want to not only document damage cases but also analyze them in a technically sound manner.

Date
09 – 13 March 2026
Location: Ermatingen, Switzerland
Chair: Prof. Dr.-Ing. Andreas Ibach, Prof. Dr.-Ing. Michael Pohl
Register now and expand your methodological expertise in damage analysis.