[Translate to English:]

The opportunity to exchange ideas with like-minded people and colleagues in a video conference, but above all to initiate processes in a targeted manner, is of particular importance in critical times. For this reason, the DGM once again refers to the technical committees and joint committees, which are pleased about the growth and input they have brought in.

A first proof of the acceptance, the value and the joy of active participation in a virtual meeting is the "Working Group Mechanical Materials Behavior at High Temperature in the Technical Committee Materials Behavior under Mechanical Stress", for which currently already more than 40 registrations - and thus significantly more than at attendance events - have been received.

The following dates are scheduled for October 2020. If you are interested, please register for one of the web-based events or contact fachgremienDGM.de in case of questions.

• 02.10.2020
  Arbeitskreis Verstärkung keramischer Werkstoffe im GA Hochleistungskeramik
• 07.10.2020
  Arbeitskreis Mechanisches Werkstoffverhalten bei hoher Temperatur im FA Werkstoffverhalten unter mechanischer Beanspruchung
• 8.10.2020
  Fachausschuss Aluminium – Workshop „Konsequenter Leichtbau“
• 22.10. – 23.10.2020
  Arbeitskreis Mikrostrukturcharakterisierung am Rasterelektronenmikroskop im GA Rasterelektroskopie in der Materialprüfung (DGM/DVM)
• 28.10.2020
  Fachausschuss Additive Fertigung

About the DGM technical committees and bodies

With more than 100 technical committees, joint committees and working groups, in which more than 2.500 experts are organized, the DGM networks, regardless of the class of material, natural science-oriented materials scientists with engineer-dominated materials technicians as well as theory with practice and research with industry - and all this at the highest level. In this way, the DGM makes an important contribution to the success of German Science and Industry and ultimately to the prosperity of our society.

Further information can be found here.