Reliability in Microelectronics
With the increasing demand for smaller and more powerful electronic devices, ensuring the mechanical robustness and reliability of microchips against crack propagation is crucial, as emphasized by Dr. Kutukova. The webinar underscored the importance of understanding crack propagation in 3D nanopattern systems for scientific advancements as well as for manufacturing mechanically resilient microchips for industrial applications. 

Innovative Methodology
For quantifying fracture mechanical behavior on this scale, a combination of an in-situ setup for applying minor loads and X-ray microscopy is recommended, as illustrated by Dr. Kutukova. Additionally, new methodological approaches are needed to control microcracks directed towards areas with critical fracture resistance. In the face of increasingly complex designs of integrated circuits (ICs) on chip interconnect stack materials, controlled crack propagation is a crucial prerequisite for successfully characterizing the fracture behavior of microchips. 

Experimental Insights and Future Perspectives
Dr. Kutukova provided detailed insights into an innovative experimental setup on which she has been researching for several years. She elaborated on the measurement techniques using Nano-XCT, enabling high-resolution 3D imaging of kinetic processes, and the use of a micro-DCB test specimen. Additionally, she presented impressive footage of controlled crack propagation experiments, aiding in the determination of locally critical energy release rates. The results and insights provided promising prospects for improving the mechanical stability of nanoelectronics in the future. 

The webinar was attended by 35 interested listeners, who took the opportunity towards the end to ask the speaker follow-up questions. Furthermore, an outlook on upcoming training opportunities was provided, promising further insights into the field of reliability in microelectronics. For more information, please visit our website.